+Title: Semiconductor Equipment Corporation - Semicorp.com
Description: SEC manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. Equipment ranges from flip chip die bonder
Keywords:Semiconductor Equipment, flip chip, die bonder, semiautomatic assembly, microelectronic, handling, surface mount rework, multichip modules, eutectic die bonder, pick and place, backlap tape applicator, wafer fracturer, BGA, wafer dicing tape, blue tape, epoxy dispenser, die expander, assembly equipment, silicon wafer, uv tape, temporary adhesives, water soluble adhesives, multifunctional bond tester, semicorp.com
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