+Title: Carsem Malaysia
Description: Carsem provides turnkey packaging and test services to the semiconductor industry. We are a member of the Hong Leong Group in Malaysia.
Keywords:turnkey test services for rf, mixed-signal, analog, digital, power, devices, semiconductor testing, system in package, micro leadframe package, fcol, flip chip on leadframe, semiconductors factory, malaysia, flipchip technology, hong leong group bhd, mpi, malaysian pacific industries berhad
